Product Information
LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion.
In many bonding applications, components may be repaired. Component joined with LOCTITE® ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
- This adhesive is also available in a low temperature cure version
- Thermally conductive : 2.0 W/m-K
- Reworkable
- Flexible
Video
No video available.
Accessories
You May Be Interested In
Customers Also Bought
Recently Viewed
There are no recently viewed products.